|
InP Wafer Specifications |
||||
|
Size |
2" |
3" |
4" |
|
|
Diameter(mm) |
50.5±0.5 |
76.2±0.5 |
100.0±0.5 |
|
|
Thickness(um) |
350±25 |
600±25 |
600±25 |
|
|
Orientation |
(100)/(111) ±0.5º |
|||
|
Major Flat Length(mm) |
16±2 |
22±2 |
32.5±2 |
|
|
Minor Flat length(mm) |
8±1 |
11±1 |
18±1 |
|
|
TTV(um) |
＜10 |
＜10 |
＜15 |
|
|
Bow(um) |
＜10 |
＜10 |
＜15 |
|
|
Warp(um) |
＜15 |
＜15 |
＜15 |
|
|
GaSb Wafer Specifications |
||||
|
Size |
2" |
3" |
4" |
|
|
Diameter(mm) |
50.5±0.5 |
76.2±0.5 |
100.0±0.5 |
|
|
Thickness(um) |
500±25 |
600±25 |
800±25 |
|
|
Orientation |
(100)/(111) ±0.5º |
|||
|
Major Flat Length(mm) |
16±2 |
22±2 |
32.5±2 |
|
|
Minor Flat length(mm) |
8±1 |
11±1 |
18±1 |
|
|
TTV(um) |
＜10 |
＜10 |
＜15 |
|
|
Bow(um) |
＜10 |
＜10 |
＜15 |
|
|
Warp(um) |
＜15 |
＜15 |
＜15 |
|
|
InAs Wafer Specifications |
|||
|
Size |
2" |
3" |
|
|
Diameter(mm) |
50.5±0.5 |
76.2±0.5 |
|
|
Thickness(um) |
500±25 |
600±25 |
|
|
Orientation |
(100)/(111) ±0.5º |
||
|
Major Flat Length(mm) |
16±2 |
22±2 |
|
|
Minor Flat length(mm) |
8±1 |
11±1 |
|
|
TTV(um) |
＜10 |
＜10 |
|
|
Bow(um) |
＜10 |
＜10 |
|
|
Warp(um) |
＜15 |
＜15 |
|